doc. no : qw0905- rev. : date : - 2005 01 - feb la38b-65/g a data sheet ligitek electronics co.,ltd. property of ligitek only led array la38b-65/g
0.5 typ 1.5max 5.2 2.54typ 25.0min 1.0min ?? 0.5 typ lg2040 4.2 3.0 4.0 note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1.0min + - la38b-65/g 1/4 page part no. 5.2 10.20.5 4.2 4.0 5.0 package dimensions 3.0 4.0 ligitek electronics co.,ltd. property of ligitek only
typical electrical & optical characteristics (ta=25 j ) absolute maximum ratings at ta=25 j note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. wave length f nm 565 p peak ligitek electronics co.,ltd. property of ligitek only tstg storage temperature part no material la38b-65/g emitted gap green green diffused lens color soldering temperature tsol part no. la38b-65/g i f forward current operating temperature reverse current @5v peak forward current duty 1/10@10khz power dissipation t opr ir pd i fp parameter symbol -40 ~ +100 10 forward voltage @20ma(v) spectral halfwidth ??f nm viewing angle 2 c 1/2 (deg) luminous intensity @ ma(mcd) 2.6 max. 30 1.7 min. 30 12 36 typ. min. max 260 j for 5 sec max (2mm from body) j 2/4 page ma 30 -40 ~ +85 10 j g a 100 120 ma mw g ratings unit
relative intensity@20ma 1.0 wavelength (nm) 600 0.0 550 500 0.5 650 fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) forward voltage@20ma normalize @25 j 0.8 -40 -20 0 20 40 1.0 0.9 1.1 1.2 relative intensity@20ma normalize @25 j 0.5 ambient temperature( j ) 60 80 100 -20 -40 20 0 0.0 40 80 100 60 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 page part no. 3/4 la38b-65/g typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) 100 0.1 1.0 2.0 3.0 10 1.0 1000 g chip relative intensity normalize @20ma forward current(ma) 0.5 5.0 4.0 1.0 0.0 10 1.5 1.0 2.0 2.5 100 1000 fig.2 relative intensity vs. forward current 3.0 3.5 ligitek electronics co.,ltd. property of ligitek only
mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202:103b jis c 7021: b-11 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to see soldering well performed or not. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles solder resistance test thermal shock test high temperature high humidity test 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hous. 4/4 page part no. la38b-65/g jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. operating life test 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) low temperature storage test high temperature storage test the purpose of this is the resistance of the device which is laid under ondition of hogh temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. test condition test item reliability test: description reference standard ligitek electronics co.,ltd. property of ligitek only
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